Technology - Hardware Intelligence
Semiconductor Packaging & OSAT
Real-time intelligence, expert analysis, and verified research for the Semiconductor Packaging & OSAT industry. Stay ahead in 3 minutes a day.
Stay ahead of Semiconductor Packaging & OSAT in 3 minutes a day.
Expert-verified intelligence delivered to your inbox every morning.
Free forever. No spam. Unsubscribe anytime.
ASE's SPIL Acquires NT$2.8B Plant Amid TSMC Advanced Packaging Capacity Crunch
SPIL acquired Taiwan Mask Corporation's Zhunan Plant 6 for NT$2.8 billion to expand capacity as AI demand strains advanced packaging.
Read full articleSamsung Mulls New Chip Packaging Plant in Gwangju for HBM Production
Samsung Electronics is conducting feasibility study for semiconductor packaging plant in Gwangju to address growing memory chip demands.
Read full articleGlass Substrates Face 70% Yield Challenge as Intel, Samsung Invest Billions
Intel invested $1B+ in glass substrates for AI chips, but 70% manufacturing yield must reach 90% for viable production.
Read full articleSamsung to Produce Google's Next-Gen AI Chip Component as TSMC Hits Capacity
Samsung in talks to make I/O component for Google's TPU 'Icefish' on 2nm process, potentially including HBM and assembly.
Read full articleThales, Foxconn Launch €250M Tessalia JV for European SiP Production
Joint venture to produce 50M+ System-in-Package components annually by 2033, creating 800 jobs in France under EU Chips Act.
Read full articleASE Reports Record May Revenue of NT$63B, Up 28.6% YoY on AI Demand
ASE hit record May revenue driven by strong AI packaging demand, with 5-month revenue reaching NT$298.94 billion.
Read full articleSPIL Marks Fifth Factory Acquisition in 2026, Spending Over NT$22.7B
SPIL accelerates expansion with fifth factory purchase this year as it struggles to meet overflow demand from TSMC outsourcing.
Read full articleSK Hynix Considers Additional Regional Investments Amid Gov't Push
SK hynix exploring investments in Chungcheong or Jeolla regions as Korean government drives balanced regional development.
Read full articleASE's SPIL Acquires NT$2.8B Plant Amid TSMC Advanced Packaging Capacity Crunch
SPIL acquired Taiwan Mask Corporation's Zhunan Plant 6 for NT$2.8 billion to expand capacity as AI demand strains advanced packaging.
Read full articleSamsung Mulls New Chip Packaging Plant in Gwangju for HBM Production
Samsung Electronics is conducting feasibility study for semiconductor packaging plant in Gwangju to address growing memory chip demands.
Read full articleGlass Substrates Face 70% Yield Challenge as Intel, Samsung Invest Billions
Intel invested $1B+ in glass substrates for AI chips, but 70% manufacturing yield must reach 90% for viable production.
Read full articleSamsung to Produce Google's Next-Gen AI Chip Component as TSMC Hits Capacity
Samsung in talks to make I/O component for Google's TPU 'Icefish' on 2nm process, potentially including HBM and assembly.
Read full articleThales, Foxconn Launch €250M Tessalia JV for European SiP Production
Joint venture to produce 50M+ System-in-Package components annually by 2033, creating 800 jobs in France under EU Chips Act.
Read full articleASE Reports Record May Revenue of NT$63B, Up 28.6% YoY on AI Demand
ASE hit record May revenue driven by strong AI packaging demand, with 5-month revenue reaching NT$298.94 billion.
Read full articleSPIL Marks Fifth Factory Acquisition in 2026, Spending Over NT$22.7B
SPIL accelerates expansion with fifth factory purchase this year as it struggles to meet overflow demand from TSMC outsourcing.
Read full articleSK Hynix Considers Additional Regional Investments Amid Gov't Push
SK hynix exploring investments in Chungcheong or Jeolla regions as Korean government drives balanced regional development.
Read full articleStay ahead of Semiconductor Packaging & OSAT in 3 minutes a day.
Live opportunity intelligence for your market, delivered to your inbox every morning. Read it over coffee.
Free forever. No spam. Unsubscribe anytime.