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Semiconductor Equipment
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Global semiconductor equipment spending hits record $36.55B in Q1 2026
Q1 2026 semiconductor equipment billings reached $36.55B, up 14% YoY, driven by AI and advanced chip demand.
Read full articleChina's Prinano claims 8-inch photonic chip production via nanoimprint tech
Chinese startup Prinano validates mass production of photonic chips using nanoimprint lithography, bypassing DUV equipment.
Read full articleASML warns Brussels against steering chip projects too closely
ASML CEO cautions EU against excessive control over strategic chip projects, citing supply chain complexity concerns.
Read full articleSamsung considers new chip packaging plant in Gwangju
Samsung Electronics reviews plans for advanced semiconductor packaging facility in Gwangju to meet growing HBM demand.
Read full articleCadence unveils first autonomous virtual engineer for chip design
Cadence launches Level-5 autonomous AI design engineer with NVIDIA, enabling 40X faster RTL validation cycles.
Read full articleIndia approves 12 semiconductor projects under ISM initiative
India's Semiconductor Mission approves 12 manufacturing projects spanning fab, packaging, and display production.
Read full articleCanon's nanoimprint lithography gains traction in photonics market
Canon's NIL systems priced at $6.4M offer alternative to EUV for photonic chips, with DNP targeting 1.4nm production by 2027.
Read full articleEU unveils Chips Act 2.0 and Cloud AI Development Act
European Commission launches technology sovereignty package to reduce dependence on foreign chip and AI suppliers.
Read full articleGlobal semiconductor equipment spending hits record $36.55B in Q1 2026
Q1 2026 semiconductor equipment billings reached $36.55B, up 14% YoY, driven by AI and advanced chip demand.
Read full articleChina's Prinano claims 8-inch photonic chip production via nanoimprint tech
Chinese startup Prinano validates mass production of photonic chips using nanoimprint lithography, bypassing DUV equipment.
Read full articleASML warns Brussels against steering chip projects too closely
ASML CEO cautions EU against excessive control over strategic chip projects, citing supply chain complexity concerns.
Read full articleSamsung considers new chip packaging plant in Gwangju
Samsung Electronics reviews plans for advanced semiconductor packaging facility in Gwangju to meet growing HBM demand.
Read full articleCadence unveils first autonomous virtual engineer for chip design
Cadence launches Level-5 autonomous AI design engineer with NVIDIA, enabling 40X faster RTL validation cycles.
Read full articleIndia approves 12 semiconductor projects under ISM initiative
India's Semiconductor Mission approves 12 manufacturing projects spanning fab, packaging, and display production.
Read full articleCanon's nanoimprint lithography gains traction in photonics market
Canon's NIL systems priced at $6.4M offer alternative to EUV for photonic chips, with DNP targeting 1.4nm production by 2027.
Read full articleEU unveils Chips Act 2.0 and Cloud AI Development Act
European Commission launches technology sovereignty package to reduce dependence on foreign chip and AI suppliers.
Read full articleStay ahead of Semiconductor Equipment in 3 minutes a day.
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